Wen Yin is an Engineering Manager with a Ph.D. in Polymer, Surface from Virginia Tech. They currently serve as a Sr. Staff Engineer/Manager at Qualcomm, where they lead an engineering team focused on new production introduction and packaging technology development for multiple RFFE products. Previously, Wen worked at Intel Corporation as a Staff Engineer and Senior Packaging Engineer, contributing significantly to the development of packaging for 10 nm and 14 nm products. Their earlier experience includes research at ORNL/UTK, where they investigated organic photovoltaics.
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