Wu Xiaoxia

Wu Xiaoxia is a Process Engineer at Intel Corporation, where they focus on optimizing chip package processes and facilitating the transition to high-volume manufacturing sites. Previously, Wu held positions as a Staff Test Module Development Engineer and a Senior Research Engineer at the Center for Reliable Energy Systems, where they collaborated on thermal interface materials and conducted extensive fracture and fatigue analysis of pipelines. Wu earned a PhD in Mechanical Engineering from the University of North Carolina at Charlotte, as well as a Master's from The Hong Kong University of Science and Technology and a Bachelor's from Harbin Institute of Technology.