Xiao Lu is a Senior Director of Advanced Packaging Assembly at Intel Foundry Technology Development, where they drive the development of FLI/SLI/Thermal packaging technologies. Previously, they held various engineering positions at Intel Corporation, demonstrating extensive expertise in advanced packaging. Xiao's academic background includes a Ph.D. in Aeronautics with a major in Solid Mechanics from the California Institute of Technology, where they also served as a Graduate Research Assistant, focusing on dynamic frictional rupture simulation in seismology. Their research contributions were recognized widely, including a feature on the cover of PNAS and coverage by notable media outlets.
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