Zakwan is a motivated and detail-oriented Process & Equipment Engineer at Intel, specializing in Thermal Compression Bonding within the semiconductor manufacturing industry. With a background in Chemical Engineering, Zakwan has demonstrated strong analytical thinking and data-driven decision-making skills. Currently, Zakwan leads problem-solving initiatives, implements process improvements, and collaborates with cross-functional teams to enhance production efficiency. Previously, Zakwan held roles as a Junior Executive at Invest Kedah and Project Engineer at Encord Sdn Bhd, where they successfully executed operational requirements and improved workflow efficiencies. Zakwan's educational background includes a Bachelor of Engineering (Hons) in Chemical Engineering from Universiti Teknologi MARA.
This person is not in the org chart
This person is not in any teams
This person is not in any offices