Zheng Ren

Zheng Ren is a Program Manager and IC Packaging Technologist at Intel Corporation, where they focus on global external manufacturing and sourcing. Zheng earned a Ph.D. in Materials Science and Engineering from the University of Connecticut, achieving a perfect GPA of 4.0. They have contributed to over 25 journal publications, 2 book chapters, and hold 2 US patents. Prior experience includes roles as a Summer Student at Stanford University, a Visiting Researcher at Oak Ridge National Laboratory, and a PhD Researcher at the University of Connecticut. Zheng completed a B.S. in Applied Physics from Beihang University, graduating with honors.