Zhicheng Ding

Zhicheng Ding is a Senior Design Engineer at Intel Corporation, bringing over 18 years of experience in the IC packaging industry. With a solid foundation in IC Packaging Engineering from Fudan University, Zhicheng has held diverse roles including Package Design Engineer and Packaging Engineer at various companies. They possess extensive knowledge in areas such as Equipment Maintenance, Process Development, and PCB Design, while also leading teams and managing design schedules. Currently, Zhicheng focuses on new product development and innovation within the technology sector, averaging around 10 patents granted each year.