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Intel
Unverified
Packaging Research and Development
118 people · 0 jobs
This department focuses on innovating and advancing packaging technologies to enhance product performance and integration.
Abid Ameen
Senior Packaging R&D Engineer
Ajay B.
Packaging R&D Engineer
Akshata Kulkarni
Akshaya Kulkarni
Amey Apte
Staff Packaging R&D Engineer
Andrew Jimenez
Packaging Research and Development Engineer
Anthony Tan
Advanced Packaging Supply Chain R&D Engineer
Arsalan Sabet
Asyraaf Bin Ariffian
Packaging Module Development Engineer
Babak Ashourirad
Sr. R&D Packaging Engineer
Bin Mu
Birinder Singh
Packaging Engineer
Bo Yu
Calvin Teoh
Advance Packaging Manufacturing System Engineer
Cheng Li
Packaging R&D engineer
Chirag Deshpande
Christy Prather
Chu-ping Fang
Chun-Te Kuo
Cole Petersburg
Advanced Packaging Process Integration Engineer
Darko Grujicic
Principal Engineer, Packaging Research Engineering Manager
David Juang
Sr. IC Packaging Engineer
Divya Jain
Packaging R & D Engineer
Dr. Vedavyas Tungala
Packaging Integration and Yield Engineer
Eduardo Garcia
Eliza Hope Miller
Advanced Packaging Cost Engineer
Farzaneh Saeedifard
Finn Larson
Gautam Medhi
Hardik Prajapati
Haris Khan Niazi
Advanced Packaging R&D Engineer
Harsh V.
R&D Packaging Engineer
Haviv Bechor
Advanced Packaging Technical Program Manager
Hiroki Tanaka
HoDong Kwon
Product Package Engineer
Huanlin Zhu
Sr. Packaging Engineer
Ibrahim Misbah
Packaging Research & Development Engineer
Jaewoo Kim
James Ofuegbe
Jasmin Ahmed
Jesus Nieto
Jiwen Xiang
Junsheng Wu
Kartik Goyal
Krishna Pandey
Packaging Research And Development Engineer
Krishna Theja
IC Packaging R&D Engineer
Kristen Rhoads
Kristof Darmawikarta
leyla kheirkhah
Packaging R&D Engineer at Intel Corporation
Lucy Yoon
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