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Intel
Unverified
Packaging Research and Development
118 people · 0 jobs
This department focuses on innovating and advancing packaging technologies to enhance product performance and integration.
Akshata Kulkarni
Packaging R&D Engineer
Amey Apte
Staff Packaging R&D Engineer
Babak Ashourirad
Sr. R&D Packaging Engineer
Birinder Singh
Packaging Engineer
Chirag Deshpande
Senior Packaging R&D Engineer
Christy Prather
Chu-ping Fang
Chun-Te Kuo
Darko Grujicic
Principal Engineer, Packaging Research Engineering Manager
Dr. Vedavyas Tungala
Packaging Integration and Yield Engineer
Eduardo Garcia
Packaging Research and Development Engineer
Gautam Medhi
Harsh V.
R&D Packaging Engineer
Hiroki Tanaka
Jaewoo Kim
Jasmin Ahmed
Packaging Module Development Engineer
Jesus Nieto
Krishna Pandey
Packaging Research And Development Engineer
Krishna Theja
IC Packaging R&D Engineer
Kristof Darmawikarta
Mark Saltas
Md Oli Uz Zaman
Md Zubair Ebne Rafique
Packaging R&D Engineer (Si Design)
Mohammad S. Alam
Mohan Y.
Muhammad Akmal Bin Kamarudin
Advanced Packaging Process Engineer
Muhammad Salahuddin Kabir
Product Packaging Integration Engineer
Nic Cool
Nurul Ashikin Mohd Nazrul Aman
Peter Walker
Qichang Wang
Raymond Denogean
Reginald Lai
Rizq Arif
Advanced Packaging Module Engineer
Robert Hill
Ryan Pole
R&D Advanced Packaging Engineer - Laser Singulation
Safina Hussain
Packaging R&D Integration Engineer
Salih Buyukkilic
Lead Supplier Integration Engineer- Packaging R&D
Sameer Damle
Senior Staff Engineer (Packaging RnD)
Sanath Ramakrishna
Microelectronic Packaging Research And Development Engineer
See Fee Wong
Subash Kattel
Subhodip Maulik (PhD
Packaging CMP R&D engineer
Tingyu Su
Wei Wei
Xiyu Hu
Substrate Packaging Engineer
Yahya Alvi
Yang Wen
Zhendong Yang
leyla kheirkhah
Packaging R&D Engineer at Intel Corporation
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