Pat Weber, currently serving as the Manager of Advanced Semiconductor Packaging at Interconnect Systems, Inc since January 2009, has extensive experience in custom semiconductor packaging and is an inventor on two patents. Prior to this role, Pat was the Chief Technology Officer at Hestia Technologies, Inc from April 1984 to December 2008, where they specialized in custom semiconductor packaging and held 19 patents.
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Interconnect Systems International, LLC - a Molex company
ISI’s uncommonly broad design and production microelectronics capabilities allow quick creation of innovative solutions that would otherwise require multiple suppliers. Since 1987, ISI has continuously improved its capabilities and experience by adding engineering talent, investing in manufacturing assets, and by completing strategic acquisitions. ISI pioneered the concept of Next Level Integration an alternative design path to integrate at the module level rather than the silicon level, resulting in lower production costs and faster time-to-market. Our in-depth design and process development knowledge and extensive manufacturing capabilities allow us to quickly execute on complex projects, which results in a comprehensive turnkey solution for our customers.