PW
Pat Weber
Manager Of Advanced Semiconductor Packaging at Interconnect Systems International, LLC - a Molex company
Pat Weber, currently serving as the Manager of Advanced Semiconductor Packaging at Interconnect Systems, Inc since January 2009, has extensive experience in custom semiconductor packaging and is an inventor on two patents. Prior to this role, Pat was the Chief Technology Officer at Hestia Technologies, Inc from April 1984 to December 2008, where they specialized in custom semiconductor packaging and held 19 patents.
Timeline
Manager Of Advanced Semiconductor Packaging
January, 2009 - present
