Michael Meckl

Michael Meckl has a substantial background in the electronics industry, with experience in various leadership roles at companies such as ENNOVI, Interplex, Molex, WIKA Group, and Amphenol-Tuchel Electronics. He currently serves as the CCA Executive Lead at ENNOVI and Global Product Portfolio Director specializing in Press-Fit & Solderless Interconnects at Interplex. Prior to his current roles, he held positions such as Leiter Entwicklung & Produktmanagement at Molex, Leiter Produkt Management at WIKA Group, and Design Engineer at Amphenol-Tuchel Electronics.