Michael Meckl

Global Product Portfolio Director - Press-fit & Solderless Interconnects at Interplex

Michael Meckl has a substantial background in the electronics industry, with experience in various leadership roles at companies such as ENNOVI, Interplex, Molex, WIKA Group, and Amphenol-Tuchel Electronics. He currently serves as the CCA Executive Lead at ENNOVI and Global Product Portfolio Director specializing in Press-Fit & Solderless Interconnects at Interplex. Prior to his current roles, he held positions such as Leiter Entwicklung & Produktmanagement at Molex, Leiter Produkt Management at WIKA Group, and Design Engineer at Amphenol-Tuchel Electronics.

Location

Heilbronn, Germany

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Interplex

Interplex is a world-class business striving to provide best-fit solutions and products. Our global footprint, technical expertise and vertically integrated manufacturing enables us to solve complex customer problems. Our unique offering is based on the combination of design skills in interconnect technology, mechanical- and high-precision engineering. Sustainability and innovation are Interplex's drivers to develop and produce products responsibly to minimize our environmental footprint and foster our approach in giving back to society.


Employees

10,000+

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