• IPC

Gerry Partida

Co-Chair IPC-6012

Gerry Partida is the Vice President of Technology at Summit Interconnect, where they leverage over 38 years of experience in the Printed Circuits Industry. They have managed tooling and planning for over 40,000 PCB designs and serve as a Co-Chair of multiple IPC committees, demonstrating their expertise in PCB standards and reliability. Gerry previously worked at Orbotech as an Application Engineer and held various engineering leadership roles at MEI. Additionally, they actively collaborate with CAD suppliers to enhance data exchange and improve design quality.

Location

Irvine, United States

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