William Capen possesses extensive experience in engineering and technical roles across various companies. As Chairperson at IPC, as well as serving as an Engineering Technical Specialist at Honeywell FM & T, William has demonstrated leadership and technical expertise. Additional roles include Midwest Engineering Sales at SemiPack Services Inc. and Senior Manufacturing Engineer III at DRS Technologies, Inc. William also worked as a PCB Assembly Engineer at SAIC. Education includes an Associate's degree in Electronics Technology from Fox Valley Technical College and studies at the University of Wisconsin-Stout from 1999 to 2008.
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