JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. 

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

Semiconductor

JCET Group

Office 46429 focuses on sales and marketing operations, driving technical solutions and account management in California.

46429

Office 5 in Singapore focuses on human resources and engineering, supporting management and IT operations.

The Singapore office focuses on engineering and quality assurance, driving innovation and reliability in processes and products.

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