JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, BOAC; all without process induced damage for reliable failure analysis and quality control.

Our application range includes:
- HAST, HTS, TMCL stressed Cu, PdCu, Au, Ag wire packages
- Silver wire packages (new)
- Wafer Level Chip Scale Package (WLCSP) (new) 
- High Tg mold compound (new) 
- Film Over Wire (FOW) (new) 
- Chip on Board (new) 
- Electrical Overstress (EOS) failure sites
- Surface contamination and corrosion
- Wedge bonds exposure
- 3D stacked-die IC package
- Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices (new)
- System in Package (SiP) (new)
- Localized decapsulation (new)
- Sensors with transparent mold compound (new)
- Bond Over Active Circuit (BOAC) with exposed copper metallization (new)
- Redistribution Layer (RDL) with PBO and copper metallization (new)
Other applications under R&D

Instruments

JIACO Instruments

Org chart

Teams

Offices

Similar companies