Weng Leo is an Asia MEMS Process Engineering Manager with over 13 years of experience in the semiconductor wafer processing engineering field. They have worked extensively on wafer manufacturing for both CMOS and MEMS devices, gaining expertise in MEMS design and packaging. Previously, Weng held various roles at Knowles Electronic and TSMC, where they successfully managed teams and led multiple process improvements, resulting in increased yield and reduced costs. Weng aspires to further roles in the semiconductor industry, particularly in IC/MEMS design and manufacturing.
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