Ryan Cheng, P.E. has built a diverse engineering career, currently serving as a Senior Mechanical Engineer at Eastman Kodak Company since 2019. Previously, Ryan held positions such as Development Engineer at National Oilwell Varco and Associate at Stress Engineering Services, Inc. Early in their career, Ryan worked as a Mechanical Project Engineer at Robbins & Myers and as an IT Admin and Programmer at Sponseller Group, Inc. Ryan holds a Master's in Mechanical Engineering from the University of Dayton and a Bachelor's in Computer Science and Engineering from The University of Toledo.
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