Ding Hsiang Wang is a Senior Technical Specialist at 科林研發股份有限公司, bringing over nine years of experience as a process engineer specializing in semiconductor etch modules. They possess extensive knowledge in plasma etching and advanced technology processes, including 10/7/5/3 nm logic etch. Previously, Ding worked as a process engineer at 應用材料公司 and played a key role in research and testing. Ding holds a bachelor's degree in Materials Science and Engineering from 國立中興大學 and a master's degree in the same field from 清華大學.
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