Greg Guymon

Greg Guymon is an accomplished Process Engineer 3 at Lam Research, where responsibilities include leading the development and optimization of advanced packaging processes for semiconductor devices. Prior to this role, Greg served as a Postdoctoral Scholar and Graduate Research Assistant at the University of Washington, contributing to research on scalable manufacturing processes for quantum optoelectronic devices and taking on teaching responsibilities in machine design analysis. Greg's experience includes internships at Intel Corporation, where significant cost savings were achieved through process optimization, and involvement in undergraduate research at Oregon State University focused on lead-free piezoelectric materials. Greg holds a Ph.D. and a Master's degree in Mechanical Engineering from the University of Washington, in addition to a Bachelor's degree from Oregon State University.