Sam Hung is a Senior Technical Specialist-FPE at 科林研發 since November 2014, specializing in thin film deposition processes such as PECVD, Cu plating, and ALD, while also leading efforts to expand market share through new application penetration. Prior to this role, Sam served as a Senior Process Engineer, focusing on ALD business expansion for the Micron account and enhancing productivity in various deposition processes. Previous experience includes a position as a Sales Representative and Application Engineer at Pfeiffer Vacuum, where responsibilities involved selling semiconductor-related products and expanding market reach. Earlier career experience includes a role as a Process Engineer at TSMC, leading projects to improve thin film processes. Sam holds a Master’s and Bachelor’s degree in Material Science and Engineering from National Cheng Kung University, completed in 2010 and 2008 respectively.
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