林倫慶Casper Lin

Casper Lin 林倫慶 is a thermal engineering professional with over 16 years of experience in thermal and acoustic management across various technology sectors, including notebooks, PCs, and 5G devices. They currently serve as a Thermal Chief Engineer at 光寶科技, having previously held roles such as Thermal Section Manager at Foxconn Technology Corporation and Thermal Section Chief at TPV Technology Group. Casper's educational background includes a Master's Degree and a Post Graduate Diploma in Mechanical Engineering from National Cheng Kung University in Taiwan. Their expertise encompasses thermal simulation, product reliability testing, and supplier management.