Benjamin Lee

Benjamin Lee is a Senior Thermal Mechanical Engineer at Lockheed Martin Space, where they have been employed since 2021. They previously worked as a Mechanical Engineer at Lockheed Martin from 2015 to 2019, focusing on spacecraft mechanical integration, particularly in thermal and propulsion systems. Benjamin also served as a Graduate Researcher at Nagoya University from 2019 to 2021, where they earned a Master of Science in Mechanical Systems Engineering with a 4.0 GPA, following a Bachelor of Science in Mechanical Engineering from San Jose State University. Their early experience includes an internship at FibroGen, Inc. and participation in the Intel Ultimate Engineering Experience program.