David Guan is a Mechanical Design Engineer with extensive experience in product development, specializing in bill of materials (BOM) management, design for manufacturing (DFM), and assembly (DFA) implementation. They have held roles at prominent companies such as Lockheed Martin as a Senior Electromechanical Engineer and previously worked as a Mechanical Engineer II at Microchip Technology Inc., where they engineered precision vacuum-sealed physics packages. David's expertise in 3D CAD and supply chain management has led to significant contributions in optimizing manufacturing processes and securing government contracts. They are currently pursuing a Bachelor of Science in Mechanical Engineering at Northeastern University.
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