John Dominski is an experienced packaging engineer currently serving as a Sr. Packaging Engineer at Lockheed Martin since May 2023. Previously, John held multiple roles at Lockheed Martin, including Packaging Engineer - Program, where responsibilities included working on government proposals, and Packaging Engineer, supporting various defense programs such as PAC-3 and THAAD while being Hazmat Certified. Earlier experiences include an R&D Packaging Internship at The J.M. Smucker Company, where John developed a microwavable packaging solution, and a Customer Packaging Internship at Unilever, where contributions included packaging feasibility and cost reductions through innovative packaging solutions. John holds a Bachelor’s Degree in Packaging Science from Michigan State University.
Location
Dallas, United States
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