Ryan Sovia is a Senior Electro-Mechanical Packaging Engineer at Lockheed Martin, where they design Call for Fire training simulators for the Department of Defense. They configure systems for efficient communication and work closely with the DOD to deliver reliable products on time. Prior to this role, Ryan gained experience as an Electro-Mechanical Packaging Engineer and held positions as a Manufacturing Engineering Intern at Nova Technologies and a Field Engineer at PCL Construction. Ryan earned a Bachelor's degree in Mechanical Engineering from the University of Central Florida in 2018.
Location
Casselberry, United States
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