Ryan Tangney is a Principal Component Engineer specializing in Initiation Ordnance, with over ten years of experience in the aerospace industry. Currently, Ryan serves as a Sr. Mechanical Engineer at Lockheed Martin, having previously held roles including Development Engineer III at Ensign-Bickford Aerospace & Defense Company and Project Manager at Cyient. Ryan interned as a Packaging Engineer at The Dannon Company and has also worked in various engineering capacities at Procter & Gamble, PepsiCo, and Opterus Research and Development. Ryan earned both a Bachelor of Applied Science and a Bachelor of Science degree in Mechanical Engineering from the State University of New York at Binghamton.
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