Ee Phay Lee

Ee Phay Lee has work experience in the field of engineering at Lumileds. Ee Phay was a Lead Engineer of the Sawing Process, responsible for various tasks such as tape mounting, tape to tape transfer, UV cure, and sawing for wafer, film, and platelet using a Disco machine. Additionally, they held the position of Lead Engineer of the Die Attach Process, where they oversaw tape lamination, die attach/flip attach, process control, and work instruction generation. Ee Phay Lee also worked as a Process Engineer of the Die Attach Process, handling tape lamination, die attach/flip attach, and providing technical support for production. Earlier in 2018, they served as a Vacation Trainee in SPC, Industrial Quality department, where they were involved in setting up SPC, data collection and analysis, and maintaining the department's database.

Ee Phay Lee completed a Bachelor's degree in Industrial Statistics with a focus on Mathematics and Statistics, Data Analysis from Universiti Utara Malaysia between 2014 and 2018.