Lei Wang

Lei Wang has 25 years of industry experience in sectors such as MEMS, magnetic recording. optical communication, and LiDAR. Lei has focused his engineering career on processing and assembling systems, from the wafer level all the way to fully integrated packaged O Components. This mix of experiences has given him a unique perspective on the advanced packaging landscape, where wafer-level packaging is becoming dominant and heterogeneous integration is replacing Moore's law. As the packaging leader at Lunminous, Lei is excited by the opportunity and the challenge of working on an audacious vision with a passionate and talented team. Lei earned his bachelor and master degrees in solid state physics from Beijing University, China, and his PhD in materials science and engineering from UCLA.