William Lee

William Lee has over six years of experience in executive engineering roles. William started their career in 2010 as the Vice President of Engineering at Ipera Technology, where they managed a team and oversaw projects related to video streaming, network, platform, security, cloud, server, and applications. In 2015, they moved to Actiontec Electronics and served as the Vice President of Software Engineering, leading software engineering teams in the USA, Shanghai, and Taipei. William'sresponsibilities included managing projects related to networking infrastructure, router, platform, security, stack, gateway, AP, Wi-Fi, and applications. Since 2016, they have been working at Macate Group as the Vice President of Engineering. In this role, they manage engineering teams located in multiple locations in the USA and offshore. William is involved in various projects related to cloud, platform, cybersecurity, network, back-end server, server run on AWS, serverless, containerization, Docker containers, Hadoop, SaaS, SoA service-oriented architecture, full stack, apps, and front-end web application. William also handles projects related to cloud, AWS, Big Data, platform, AI Artificial Intelligence, ML Machine Learning, and search.

William Lee holds a Master of Science degree in Computer and Information Sciences from the University of Minnesota. No specific dates or duration of the program were provided.