Brian Condie is a Sr Principal Engineer at MACOM, with a solid background in radio frequency packaging engineering within the semiconductor industry. They have previously held positions at Tesla as a Staff Industrialization Engineer, Infineon Technologies as a Staff RF Packaging Engineer, and Freescale Semiconductor as a Senior Failure Analysis Engineer. Brian holds a BS in Materials Science and Engineering from the University of Arizona and is currently pursuing further education in the same field at Arizona State University. Known for their expertise in cost reduction, failure analysis, and product development, they have contributed to significant advancements and savings in various engineering roles.
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