Dan Bouchard

Dan Bouchard is a seasoned engineering professional with extensive experience in the semiconductor industry. Currently serving as Principal Process Engineer at MACOM since September 2017, Dan specializes in diffusion, epitaxy, ion implantation, PECVD, and ALD technologies. Prior to this role, Dan was with Tokyo Electron US, holding positions as Product Support Manager and Product Development Specialist, focusing on Gas Cluster Ion Beam Technology from November 2011 to September 2017. Dan's career also includes significant contributions at Evergreen Solar, where as a senior engineering team member, the successful ramping of prototype string ribbon wafer technology was achieved, leading to a production output exceeding 2 million wafers per week. Additionally, experience at Intel Corporation as Senior Process/Equipment Engineer involved leading defect reduction initiatives, while earlier roles at Digital Equipment Corporation emphasized equipment engineering and maintenance across various fabrication technologies.