Darin Bell

Darin Bell is a seasoned engineering professional with extensive experience in physical design and layout engineering. Currently serving as a Senior Layout Engineer at MACOM since November 2022, Darin's previous role was as a Senior Staff Engineer in RF/AMS Physical Design at GOODIX Technology INC. from February 2020 to October 2022, where involvement included mixed signal block level support. Prior to that, Darin held the position of Physical Design Manager/Senior Layout Engineer at Littelfuse from January 2002 to February 2020, specializing in the development of complete chip layouts for various analog and mixed signal projects. Darin's career began at Silicon Systems/Texas Instruments Inc., where, from 1988 to 2001, responsibilities included developing chip layouts for Read/Write-Preamplifier products, earning notable accolades including two President Check Awards and six Works First Time Awards for exceptional project execution.