Zoe C. is an experienced engineering professional with a robust background in semiconductor manufacturing and research. With a tenure at Taiwan Semiconductor Manufacturing Company, Ltd. from April 2011 to March 2022, Zoe held the role of Senior R&D Engineer, specializing in the development of heterogeneous silicon-package systems, including fan-in WLCSP, InFO PoP, InFO-MUST, InFO_OS, and SoIC, along with expertise in package test vehicle design. Prior to that, Zoe contributed as an Engineer focused on CMOS Logic product manufacturing, particularly in GPUs, emphasizing mass production and yield improvement. Currently, since June 2022, Zoe serves as a Senior Staff Engineer at 邁威爾科技有限公司, leading the NPI to mass production of CoWoS products and overseeing the functional development of RDL interposer technology. Additionally, Zoe's early experience includes a role as a Research Assistant at the NATIONAL APPLIED RESEARCH LABORATORIES from 2009 to 2010.
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