Zeev Markman is an experienced FPGA/ASIC/VLSI engineer currently serving as a Principal Chip Design Engineer at MaxLinear, focusing on MAC layer design for cable DOCSIS 4.0 chips. Previously, Zeev held various engineering roles, including System & Hardware Principal Engineer at OSR Enterprises AG, where they contributed to the development of advanced automotive technology, and at Noveto, where Zeev worked on the innovative SoundBeaming™ device. With a solid educational background in Microprocessor Systems and Radio Communication, Zeev brings extensive expertise in chip design and system validation to the field.
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