Ranjan Mathew

Ranjan has an extensive background in IC packaging design and assembly process development. He was at Intel Corp. for 10+ years, supporting marketing and strategic planning groups with NPI program management , value engineering , product and package design analysis for Embedded Systems, LAN, Server ,Mobile and Desktop CPU and chipset products. Prior to Intel, he was at National Semiconductor Corp. with 15+ years of hands on IC packaging assembly process development in areas ranging from wirebond ,flip chip , microdisplays, MEMS acoustic microphones to electroplating systems. His team developed the industry’s first temperature sensor and op-amp in a wafer level chip scale package (CSP) technology. Ranjan has a MS in Chem. E from University of California, Berkeley and a B.Tech in Chem. E from Indian Institute of Technology, Madras. He has over 30 patents issued in Packaging and Assembly Technology.