Rob Simpson is a seasoned packaging engineer with significant experience in the automotive and aerospace industries. Currently serving as a Packaging Engineer at Mercedes-Benz USA since October 2022, Rob previously held the position of Senior Packaging Engineer at Yamaha Motor Corporation from December 2020 to October 2022 and at UTC Aerospace Systems from July 2018 to December 2020. Rob's earlier experience includes a role as Packaging Engineer at General Motors from March 2011 to October 2017, where contributions were made to the GMCCA Plant and Distribution Center, and at Hella as a Packaging Engineer specializing in automotive electronics packaging from January 2007 to January 2010. Rob holds a Bachelor of Science in Packaging Engineering from Michigan State University and an MBA from the University of Michigan.
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