MediaTek
Aaron Lee is a highly experienced cellular RFSW engineer currently at MediaTek since February 2023, specializing in 5G/4G modem RFSW. Previously, Aaron worked at Meta from April 2021 to January 2023 as a cellular firmware engineer, leading modem integration and RF driver implementation for AR and wearable devices. Prior roles at Google included significant contributions to modem integration for Google Pixel and Nest products, enhancing regional and carrier performance. Aaron's career began at Motorola Mobility LLC, where leadership in modem integration for multiple smartphone series was pivotal. Aaron also held engineering positions at Innostream, focusing on messaging services and network requirements. Aaron holds a Bachelor's Degree in Electrical & Computer Engineering from Hanyang University, earned in 2002.
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