Beiping Liu is an accomplished Technical Product Manager at MediaTek since June 2022, with prior experience as a Device Technical Manager at 台湾积体电路制造股份有限公司 from April 2021 to June 2022, focusing on N5/N4 devices. Beiping has a strong background in SRAM and MTP cell development, project management, and device characterization gained during tenures as a Senior and Member of Technical Staff at GlobalFoundries from January 2017 to April 2021. Beiping's career also includes significant roles at United Microelectronics Corporation (UMC) from November 2007 to January 2017, where achievements included smaller SRAM development for 40nm processes and establishing a 40eHV platform in Singapore. Beiping began the career as a Process Integration Engineer with TSMC China in 2007 and as an Etch Engineer at the Shanghai ICRD Center in 2006. Beiping holds a Master of Science in Microelectronics from the University of Chinese Academy of Sciences and a Bachelor of Science in Electronics Science & Technology from Fudan University.
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