Chris Syu is a Senior Technical Manager at MediaTek Inc., where they oversee IC package design and align cost strategies across multiple product lines. With a strong background in semiconductor packaging, Chris has experience in novel wafer processes and project leadership, having previously served as a Senior R&D Engineer at TSMC from 2010 to 2014. They hold a Master's degree in Power Mechanical Engineering from National Tsing Hua University and a Bachelor's degree in Mechanical Engineering from National Chung Hsing University. Chris has contributed to various advanced projects, including the development of MediaTek's first CoWoS package design.
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