FA-CHUAN CHEN is an IC Packaging Technical Manager with over 14 years of experience in IC packaging development and new product introduction (NPI), specializing in FCCSP, WLCSP, and automotive SiP. FA-CHUAN previously served as a Technical Program Manager at 艾克爾國際科技股份有限公司 from 2017 to 2020, where they focused on OSATs NPI project management. Currently, FA-CHUAN is leveraging their expertise in warpage control, reliability validation, and OSAT collaboration at 聯發科. They are passionate about bridging design and manufacturing to provide robust and cost-effective packaging solutions.
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