Feng Lu

Feng Lu is an accomplished tech executive with over 20 years of experience in the mobile and semiconductor industry. They served as a wireless modem and chipset engineering lead at Qualcomm from 2018 to 2021, where they were pivotal in developing the SDX55 high power mmW CPE chipset and the industry-leading 9150 C-V2X solution. Currently, as Associate Vice President at MediaTek, Feng leads communications system design. Prior to this, they co-founded ESWIN, where they held the position of Co-CTO and Head of R&D, overseeing a team of 250 and guiding the development of RISC-V CPU cores and various commercial products. Feng earned a Ph.D. in Electrical Engineering from Purdue University.