宋依庭

依庭 宋 is a Package Technology Senior Engineer at 聯發科, focusing on IC packaging engineering and the development of new NPI products. Previously, they held roles in customer quality management at 巴斯夫 and backend quality and reliability engineering at 台積電, where they contributed to semiconductor material quality management and customer relationship management. 依庭 has received several accolades, including the TSMC Distinguished Engineers Award Personal Silver Medal. They possess strong skills in organic chemistry and innovative problem-solving, backed by effective time management and communication abilities.