Robin Liao

Robin Liao is a Senior Product Marketing Manager at MediaTek since May 2022, bringing extensive experience in RF connectivity and circuit design. Prior to MediaTek, Robin held the position of Bluetooth CFE at Intel Corporation for a brief period from December 2021 to April 2022. Robin's career began at Wistron Neweb Corporation as an RF Design Engineer, focusing on RF circuit design, schematic and layout drafting, and RF testing from October 2011 to December 2012. Additionally, Robin specialized in WiFi and Bluetooth RF module hardware development and verification at ASUS from December 2012 to July 2020. Academic credentials include a Master’s degree in electronics, RF IC design, and analog circuit design from National Taiwan University of Science and Technology, completed in 2011.