Ryan Tseng is a Technical Manager at 聯發科, where they serve as the key point of contact for mass production ARM CPU tape-out and implementation methodologies. Previously, Ryan was a Senior Engineer at 聯發科技 from 2017 to 2023, and before that, they gained experience as an Engineer at 台積電 from 2013 to 2017, where they contributed to more than ten tape-outs in advanced processes and filed two US patents. Ryan holds a Master's degree in Engineering from 交通大學, which they earned in 2013.
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