Sam T. is a senior product engineer with extensive experience in VLSI product yield improvement and device development. They have served as HBM Principle Engineer & Package Integration Leader at Micron Technology from 2022 to 2024 and as Advance Package Senior Integration Leader at 美光科技 from 2019 to 2022. Currently, they are a Senior Technical Product Manager at 聯發科技, where they address complex yield-related issues through collaboration with cross-functional teams. Sam holds a Bachelor’s degree in Electronics Engineering from 國立高雄師範大學 and a Master’s degree in Electrical Engineering from 國立成功大學. Prior to these roles, they worked as a Senior Product Development Engineer at TSMC from 2007 to 2019 and interned at ITRI from 2006 to 2007.
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