Siddharth Alur is a seasoned professional in Advanced Packaging with 14 years of experience specializing in substrate architectures, including EMIBTM and heterogeneous integration. They held positions at Intel, where they contributed to the establishment of manufacturing processes and design rules for advanced packaging, particularly in the datacenter and AI sectors. Currently, Siddharth serves as a Senior Staff Packaging Engineer at MediaTek, focusing on advanced heterogeneous packaging. They are pursuing a degree in Physics from the Indian Institute of Technology, Madras, and hold a Ph.D. from Auburn University.
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