佳宏 孫

佳宏 孫 has a strong background in semiconductor packaging and integration engineering. 佳宏 started their career at Memjet Technology in 2017, where they worked as a Senior wafer integration engineer. In this role, they were responsible for handling foundry site supplier and assembly site wafer related defects. 佳宏 successfully improved product lifetime by 10% by identifying and fixing a hardware issue with the CP probe. 佳宏 also played a key role in driving supplier process yield improvement and maintaining it.

In 2007, 孫 joined Amkor Technology as a Section Manager. 佳宏 led a team in introducing TI DLP new wafer level package process products, including pico projection chips used in AR/VR applications and 4k resolution projection chips. 佳宏 later transitioned to the role of Senior Integration Engineer, where they focused on improving die level package device yield and managing high-resolution device integration projects.

Most recently, 孫 joined MEMS Drive Inc. in 2021 as a Package engineer team leader. Here, they successfully developed a MEMS OIS chip assembly process for image chips with MEMS OIS actuator chips. 佳宏 led the Taiwan engineering team from lab process to small volume manufacturing in the factory within one year. 佳宏'swork resulted in the product passing reliability and critical drop tests of up to 1.5m.

Overall, 佳宏 孫 has a track record of successfully leading teams, driving process improvement, and ensuring the quality and reliability of semiconductor products throughout their career.

佳宏 孫 completed their Bachelor's degree in Materials Engineering from Tatung University from 2004 to 2006. Prior to that, they pursued their Bachelor's degree in Materials Engineering at Taipei Science and Technology University from 2000 to 2004, with a specialization in Materials Engineering.