Dawei Lin is an experienced engineer with a Master's degree in Chemical Industry from National Chung Cheng University. Dawei has held various positions in prominent companies, including a staff role as a Fingerprint Module Process and Material Development Engineer at TDK InvenSense from May 2017 to May 2020, focusing on ultrasonic fingerprint module process development and supply chain management. Additional experience includes working as a Product Engineer at Cando (AUO group), where Dawei contributed to improving touch panel module process yields, and roles at Meta as a System HW Integration Engineer, Unipixel as an NPI Engineer, and Froresystems as a Testing Engineer. Dawei's earlier career involved process engineering at AUO and product integration at Qualcomm, enhancing MEMs technology module processes during the NPI phase.
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