Feng Ding is an experienced professional in the field of semiconductor engineering, currently serving as a Silicon Engineer at Meta, focusing on custom chip design for AR glasses within the Reality Lab. Prior experience includes a role as a SoC Infra performance architect at Qualcomm Inc, where Feng worked from May 2012 to September 2024, specializing in memory subsystems, including NoC, system cache, memory controllers, and resource management. Feng holds a Master of Science in Electrical and Electronics Engineering from Columbia University and another Master of Science in Computer Science from the Georgia Institute of Technology, graduating with a perfect GPA of 4.0.
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