Hung che Weng is an experienced engineer specializing in materials science and engineering. Weng started a professional career at United Microelectronics Corporation (UMC) as a Process Engineer from April 2018 to July 2019. Later, Weng advanced to the role of Advanced Packaging Integration Engineer at 台積電 from October 2019 to May 2024. Currently, Weng serves as a Silicon Package Development Engineer at Meta since May 2024. Weng obtained a bachelor's degree in materials science and engineering from 國立清華大學 in 2014 and a master's degree in the same field from the same institution in 2016.
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