Jeff Yang

Jeff Yang is an experienced professional in the semiconductor packaging and manufacturing industry, with a career spanning from 1995 to the present. Jeff began as an IC Packaging/Process Manager at Texas Instruments (acquired by Micron) and held subsequent roles including Director of Advanced Packaging at Amkor Technology and Director of Flip Chip/Wafer Level Packaging at STATS ChipPAC. From December 2008 to April 2014, Jeff served as Packaging and Manufacturing Manager at Analog Devices. After that, Jeff was the SiP&PCBA/DFM Lead at Apple from April 2014 to October 2021. Currently, Jeff holds the position of Manager of Product Operations at Meta since October 2021. Jeff earned a Ph.D. in Mechanical Engineering from University College London, University of London.