Jiahao Wei

Research Scientist Intern

Jiahao Wei is a Mechanical Engineer currently pursuing a Doctor of Philosophy (PhD) at The Johns Hopkins University, expected to graduate in 2026. Jiahao holds a Master of Science (MS) in Engineering Mechanics from Brown University and a Bachelor’s Degree in Mechanical Engineering from Washington University in St. Louis. Professional experience includes serving as a Hardware Engineering Intern at Apple, where theoretical solutions and FEA modeling of wrinkles in the OLED manufacturing process were developed, and currently working as a Research Scientist Intern at Meta since July 2025.

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Baltimore, United States

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